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Oak board · Arch frame · Studio seal

MG-L20W Phone Back Cover Glass Laser Disassembly Glue Removal Soldering Wick built-in buckle motherboard connector

SKU: 96796549091

Listed price
USD268.00
USD296.00

Pay in 4 interest-free payments of $67.00 Learn more

Studio score
4.4

Atelier verified · Current finish lot

Fit · Measure
Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Nov 3 - Nov 8

Description

MG L20W Phone Back Cover Glass Laser Disassembly Glue Removal Soldering Wick built in buckle motherboard connector built in buckle motherboard connector 1 x Sync adapter

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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