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Amaoe BGA Reballing Stencil For Huawei CPU RAM WIFI IC HW1-HW19 phone other accessories Applications: cell phone motherboard repair

SKU: 35540526418

Listed price
USD34.99
USD67.99

Pay in 4 interest-free payments of $8.75 Learn more

Studio score
4.5

Atelier verified · Current finish lot

Fit · Measure
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Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Nov 10 - Nov 15

Description

Amaoe BGA Reballing Stencil For Huawei CPU RAM WIFI IC HW1 HW19 phone other accessories Applications: cell phone motherboard repair Applications: cell phone motherboard repair such as SOIC CHIP QFP PLCC and BGA etc (especially for flat cables and cable connectors)

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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