SKU: 28604168283
Ships within 48 hours · Estimated delivery Sep 13 - Sep 18
Thickening 3mm copper plate to increase the stability of thermal conductivity
Specification: Model No: 3005D-IV
equipped with 1/2 inch IMX334 Sony chip
Package size : 78*75
has excellent load and line regulation rate
QianLi iPhone 15 Series Middle Frame Reballing Platform 6 In 1 Set Option:Qianli 15 Series Mid Frame Reballing Platform Thickening 3mm copper plate toQianli 15 Series 6 In 1 Reballing Platform For iPhone 15 15 Plus 15 Pro 15 Pro Max Motherboard Middle Frame Reballing Soldering Repair. QianLi iPhone 15 middle layer frame reballing fixture with CN US Version BGA stencil for iPhone 15 series motherboard disassembly assembly repair. Features: 1. Qianli 15 series 6 in 1 middle frame reballing platform for iPhone 15 15Plus 15 Pro 15 Pro Max. 2. QianLi 15 Series Middle Frame Reballing Platform standard
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